发明名称 |
Compositive laminate substrate with inorganic substrate and organic substrate |
摘要 |
A compositive laminate substrate applicable for integrated and minimized electronic circuits is composed of at least an inorganic substrate and an organic substrate. The inorganic substrate is embedded with resistors, capacitors and inductors. Through the organic substrate (printed circuit boards), outer I/O ports are connected with the passive components of the inorganic substrate.
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申请公布号 |
US2004211954(A1) |
申请公布日期 |
2004.10.28 |
申请号 |
US20030619591 |
申请日期 |
2003.07.16 |
申请人 |
WU SHIH-HSIEN;LEE MIN-LIN;LAY SHINN-JUH |
发明人 |
WU SHIH-HSIEN;LEE MIN-LIN;LAY SHINN-JUH |
分类号 |
H01L23/538;H05K1/03;H05K1/16;H05K3/46;(IPC1-7):H01L29/06 |
主分类号 |
H01L23/538 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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