发明名称 Compositive laminate substrate with inorganic substrate and organic substrate
摘要 A compositive laminate substrate applicable for integrated and minimized electronic circuits is composed of at least an inorganic substrate and an organic substrate. The inorganic substrate is embedded with resistors, capacitors and inductors. Through the organic substrate (printed circuit boards), outer I/O ports are connected with the passive components of the inorganic substrate.
申请公布号 US2004211954(A1) 申请公布日期 2004.10.28
申请号 US20030619591 申请日期 2003.07.16
申请人 WU SHIH-HSIEN;LEE MIN-LIN;LAY SHINN-JUH 发明人 WU SHIH-HSIEN;LEE MIN-LIN;LAY SHINN-JUH
分类号 H01L23/538;H05K1/03;H05K1/16;H05K3/46;(IPC1-7):H01L29/06 主分类号 H01L23/538
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