KINETIC SPRAY APPLICATION OF COATINGS ONTO COVERED MATERIALS

摘要

Disclosed is a process for applying a kinetic spray coating of powder particles onto a substrate (86, 92, 116) covered in a plastic-type material (82, 84, 90, 112, 114) without first removing the plastic-type material (82, 84, 90, 112, 114). In one use of the process a mask (118, 122) is used to enable a single kinetic spray pass to both remove the plastic covering (82, 112) and bind particles having average nominal diameters of from 60 to 250 microns to the underlying substrate (86, 92, 116). In another use of the process the particles have an average nominal diameter of from 250 to 1400 microns and the use of a mask (118, 122) is optional because the particles can penetrate the plastic material (82, 84, 112, 114) and bind directly to the substrate (86, 92, 116). The process finds special use in forming electrical connections or solderable pads anywhere along the length of a flexible circuit.