| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate processing device which is capable of preventing a wafer or a holding member from being charged with electricity and reducing the particles sticking to them. SOLUTION: The substrate processing device which feeds processing fluid to a substrate for processing is equipped with a plurality of holding members 70 which hold the peripheral edge of the substrate, and supporting members supporting the holding members 70. The continuous part 90 of the holding member 70 is composed of a bearing part 78 coming into contact with the substrate, and supporting parts 86 and 87 that are continuously joined together, and is formed of electrically conductive material and furthermore grounded. COPYRIGHT: (C)2005,JPO&NCIPI |
