| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device and its manufacturing method in which in a semiconductor package in which an external terminal is electrically connected to a semiconductor chip by an inner lead on an insulating film face, it is intended to prevent a short-circuit between the inner leads in a production process and actual use, a short-circuit between the semiconductor chip and the inner lead and a disconnection of the inner lead. SOLUTION: The semiconductor device comprises a conductive inner lead formed on an insulating film, a semiconductor element connected electrically to the inner lead on the inner lead, a frame body arranged so as to enclose the semiconductor element on the inner lead, a support plate arranged across on the semiconductor element and on the frame body, and a plurality of external electrodes connected to the inner lead through a conductor penetrating the insulating film. In the insulating film and the inner lead, a curved part is arranged between an electrode of the semiconductor element and the external electrode. COPYRIGHT: (C)2005,JPO&NCIPI
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