| 摘要 |
A cleaning apparatus cleaning a chuck is provided with a cleaning tank, an injection nozzle, a discharge nozzle, a liquid supply mechanism and a gas supply mechanism. The liquid supply mechanism has a supply tank, a heater and a liquid distribution mechanism so that the heater heats pure water supplied from the supply tank under the room temperature for forming warm water, reduced in electrical resistance, heated to a temperature higher than the room temperature. The liquid supply mechanism supplies the formed warm water to the cleaning tank through the liquid distribution mechanism. A vertical moving mechanism moves down a transport arm thereby dipping the chuck in the warm water and cleaning the chuck. Thus, the throughput of the cleaning apparatus cleaning the chuck is improved, the quantity of consumed gas is reduced and cleaning performance is improved.
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