ELECTRONIC COMPONENT PACKAGE, ELECTRONIC COMPONENT PACKAGE ASSEMBLY AND PRINTED BOARD UNIT

摘要

In a printed board unit (11), an electronic component package (13) is mounted on the surface of a printed board (12). In the electronic component package (13), an electronic component (16) is covered with a heat spread member (19) spreading wider than the surface of the electronic component (16). On the surface of the heat spread member (19), a touching body (22) is arranged to touch the surface of the heat spread member (19) over an area smaller than the surface of the electronic component (16). A heat dissipation member (22) is laid on the surface (19c) of the heat spread member (19). The heat dissipation member (22) has a flat surface (22c) facing the surface of the heat spread member (19) around the touching body (22). Stripping can be avoided surely between the heat spread member (19) and the surface of the electronic component (16). Heat can be transmitted surely from the electronic component (16) to the heat spread member (19).