发明名称 |
METHOD FOR PRODUCING SOLDERING GLOBULES ON AN ELECTRICAL COMPONENT |
摘要 |
The invention relates to a method for producing contactings provided in the form of soldering globules (20) on an electrical component comprising a base body (1). To this end, a stencil (5) is placed on the base body and bore holes (10) are made therein while passing through the stencil (5). Fillings (15) are produced by filling the bore holes with an electrically conductive material and by the subsequent hardening thereof. Afterwards, soldering globules (20) are produced directly on the surfaces of the fillings whereby enabling the external electrical contacting of the fillings. |
申请公布号 |
WO2004093100(A2) |
申请公布日期 |
2004.10.28 |
申请号 |
WO2004DE00769 |
申请日期 |
2004.04.14 |
申请人 |
EPCOS AG;FEICHTINGER, THOMAS;PUDMICH, GUENTHER |
发明人 |
FEICHTINGER, THOMAS;PUDMICH, GUENTHER |
分类号 |
H01C1/144;H01C17/28;H01L21/48;H01L23/485;H01L23/498;H05K1/03;H05K1/11;H05K3/34;H05K3/40;H05K3/46 |
主分类号 |
H01C1/144 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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