| 摘要 |
In one embodiment, a mold for forming a molded part includes a baseplate, at least one pot formed in the baseplate for receiving a mold compound, and at least one cavity formed in the baseplate. The cavity is adapted to receive a microelectronic device. The mold also includes at least one channel system formed in the baseplate and coupled to the at least one pot and further coupled to the at least one cavity. The mold further includes at least one first channel formed in the baseplate and coupled to the at least one channel system. The at least one first channel is separated from the at least one cavity by the at least one channel system. |
