发明名称 |
CLOCK MECHANISM |
摘要 |
|
申请公布号 |
CA328995(A) |
申请公布日期 |
1933.01.03 |
申请号 |
CAD328995 |
申请日期 |
|
申请人 |
STEPHEN PRENSZNER |
发明人 |
STEPHEN PRENSZNER |
分类号 |
|
主分类号 |
|
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|
您可能感兴趣的专利
Reclosable Pouch with Leakproof Closure and Method of Manufacture
Image Recomposition From Face Detection And Facial Features
Synchronization of Nodes in a Network
OPTIMIZED PAGE MATCHING
BACKPLANE WITH ENERGY SAVING FUNTION
Remote Control Floating Fishing Light
TWO-COMPONENT DIRECT-INDIRECT LIGHTING SYSTEM
PROTECTIVE COVER AND ELECTRONIC DEVICE THEREWITH
LOW THERMAL STRESS CATADIOPTRIC IMAGING SYSTEM
OPTICAL REFLECTION ELEMENT
Multi-Domain Vertical Alignment Liquid Crystal Display Panel
ARRAY SUBSTRATE, MANUFACTURING METHOD THEREOF, LIQUID CRYSTAL PANEL, AND DISPLAY DEVICE
METHOD AND APPARATUS FOR OBJECT TRACKING AND RECOGNITION
Depth Image Compression
DEBOUNCE SWITCHING ELEMENT INCORPORATING A DEBOUNCE CIRCUIT
ORGANIC LIGHT EMITTING DIODE DRIVING CIRCUIT, DISPLAY PANEL, DISPLAY AND DRIVING METHOD
DEVICE FOR FEEDING ELECTRICITY TO EQUIPMENT, THE DEVICE BEING INCORPORATED IN THE FLOOR OF AN AIRCRAFT CABIN
RECORDING MEDIUM SUPPLYING DEVICE AND IMAGE FORMING APPARATUS
Manufacture process for high wear-heat resistant parts carbon brushes & brake pads ASTM preform slurry electrolyte carbon nanofoam CNFs & 2.5 phase design and precision die cast extrusion for highly pure metal, super alloy, ceramics, alkaline, and alkalide
SOLDER BONDING PROCESS FORMING A SEMICONDUCTOR CHIP IN MULTIPLE STAGES ON A 3-DIMENSIONAL STACKED ASSEMBLY