LEAD-FREE ALLOYS FOR COLUMN/BALL GRID ARRAYS, ORGANIC INTERPOSERS AND PASSIVE COMPONENT ASSEMBLY

摘要

A lead free solder hierarchy structure for electronic packaging that includes organic interposers. The assembly may also contain passive components as well as underfill material. The lead free solder hierarchy also provides a lead free solder solution for the attachment of a heat sink to the circuit chip with a suitable lead free solder alloy.