| 发明名称 |
Dicing/die bonding adhesion tape |
| 摘要 |
A dicing/die bonding adhesion tape includes a substrate, a silicone adhesive layer, and a bonding layer. A tack strength of 0.2-2.0 N/25 mm is developed between the silicone adhesive layer and the bonding layer. The bonding layer is formed of a bonding composition comprising (A) a polyimide resin, (B) an epoxy resin, and (C) an epoxy resin curing catalyst.
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| 申请公布号 |
US2004213994(A1) |
申请公布日期 |
2004.10.28 |
| 申请号 |
US20040829150 |
申请日期 |
2004.04.22 |
| 申请人 |
KOZAKAI SHOUHEI;SUZUKI AKIO;ICHIROKU NOBUHIRO;SHIOBARA TOSHIO |
发明人 |
KOZAKAI SHOUHEI;SUZUKI AKIO;ICHIROKU NOBUHIRO;SHIOBARA TOSHIO |
| 分类号 |
C09J7/00;C09J7/02;C09J163/00;C09J179/08;C09J183/04;H01L21/301;H01L21/52;H01L21/58;H01L21/68;(IPC1-7):B32B7/12 |
主分类号 |
C09J7/00 |
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