| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a packaging method of an electronic component which can prevent the generation of a bridge between packaging components, deficiency generation at the time of packaging and solder non-wetting on a land of a substrate. <P>SOLUTION: In the packaging method of an electronic component wherein electronic components are soldered and fixed on a substrate, a solder plating thickness to the electrode of the component and a land length on the substrate to an electrode length are prescribed. A recess is formed in the land. When the components are attached on the substrate, the supply of positive pressure to a sorbing nozzle is stopped immediately before or during the ascending of the sorbing nozzle after component attachment. An amount of the warpage of the fixed substrate is measured, and the component attachment height of the sorbing nozzle is corrected based on the obtained amount of the warpage. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
