摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a three-dimensional structure measuring instrument capable of specifying the physical structure of a three-dimensional micro-component on a microchip, and a three-dimensional structure measuring system. <P>SOLUTION: The three-dimensional structure measuring instrument is equipped with the microchip 1 becoming a substrate, the rotor 4 provided on the microchip 1 and receiving a sample to rotate the same, the radiation source 2 provided on the microchip 1 to irradiate the sample with an energy beam, a sensor array 3 arranged so as to surround the periphery of the rotor 4 to detect the energy beam passed through the sample, a mechanism for moving the rotor 4 in the direction of a rotary axis, a sample introducing hole 6 and a sample sucking hole 7. As the mechanism for moving the rotor 4 in the direction of the rotary axis, an electrostatic motor, a deforming element or the like is designated. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |