| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an epoxy resin composition which has excellent burr characteristics and excellent heat conductivity, gives little curved area mount type semiconductor device, and has an excellent temperature cycling property. <P>SOLUTION: This epoxy resin composition for sealing semiconductors is characterized by containing (A) spherical alumina, (B) superfine silica having a specific surface area of 120 to 280 m<SP>2</SP>/g, (C) a silicone compound, (D) an epoxy resin, (E) a phenolic resin curing agent, and (F) a curing accelerator as essential components, wherein the amount of the superfine silica is 0.2 to 0.8 wt. % based on the total amount of the epoxy resin composition. The silicone compound is preferably a polyorganosiloxane and is contained in an amount of 0.3 to 2.0 wt. % based on the whole resin composition. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
