| 摘要 |
PROBLEM TO BE SOLVED: To provide an apparatus for substrate treatment in which initial cost and running cost can be reduced, an extensive installation space is not required, the electric characteristic of wires is not degraded, and a protective film of high quality is efficiently deposited on the surface of a metal part. SOLUTION: A substrate having a metal part on the surface thereof is prepared. The surface of the substrate is brought into contact with pre-treatment solution to perform plating pre-treatment to decorate the entire surface. The pre-treatment solution remained on the surface of the substrate is removed by rinsing. The surface of the substrate is subjected to electroless plating to selectively deposit an alloy film on the surface of the metal part, and the substrate after the electroless plating is post-cleaned and dried. COPYRIGHT: (C)2005,JPO&NCIPI
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