发明名称 |
ELECTROLESS PLATING METHOD |
摘要 |
An electroless plating method of the present invention includes the steps of preparing a substrate having an insulating body and a conductive pattern formed thereon, adhering a catalytic metal serving as a catalyst of an electroless plating onto the insulating body and the conductive pattern, forming selectively a protection film or an oxidizing agent used to oxidize the catalytic metal on the catalytic metal in a space portion between the conductive pattern, and forming selectively a metal layer on the conductive pattern by the electroless plating.
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申请公布号 |
US2004213912(A1) |
申请公布日期 |
2004.10.28 |
申请号 |
US20040709138 |
申请日期 |
2004.04.15 |
申请人 |
SHINKO ELECTRIC INDUSTRIES CO., LTD. |
发明人 |
MURAYAMA KEI |
分类号 |
C23C18/30;C23C18/16;C23C18/28;H05K3/18;H05K3/24;H05K3/28;(IPC1-7):B05D1/36 |
主分类号 |
C23C18/30 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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