发明名称 |
Method for producing solid-state imaging device |
摘要 |
A method for producing a solid-state imaging device including a base of an insulation material having a frame form in planar shape with an aperture formed in an inner region thereof and having a substantially uniform thickness; a wiring provided on one surface of the base and extending toward the outside from the peripheral portion of the aperture; and an imaging element mounted on the surface of the base provided with the wiring so that a light-receptive region of the element faces the aperture. Cavities for resin-molding a plurality of the bases are formed and a tape member supporting thin metal plate leads for forming a plurality of sets of wirings corresponding to the respective bases is loaded between molds having pins for forming positioning holes of the base; and the thin metal plate leads are placed in the cavities. Then, a sealing resin is filled in the cavities and cured. A resin molded member, in which the thin metal plate leads are embedded, is taken out; and the tape member is removed from the resin molded member, and the resin molded member is divided into a plurality of pieces on which an imaging element is mounted. The base on which the imaging element is mounted can be formed to have a practically sufficient flatness. |
申请公布号 |
US2004214369(A1) |
申请公布日期 |
2004.10.28 |
申请号 |
US20030669229 |
申请日期 |
2003.09.24 |
申请人 |
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. |
发明人 |
MINAMIO MASANORI;HORIKI HIROSHI;NISHIO TETSUSHI |
分类号 |
H01L27/14;H01L23/00;H01L23/08;H01L27/146;H01L31/02;H01L31/0203;H04N5/335;(IPC1-7):H01L21/44 |
主分类号 |
H01L27/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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