| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of a multilayer printed wiring board which improves the connection reliability and the wiring housing property of a core board with micro-vias formed just above through-holes of the core board. SOLUTION: The method comprises forming through-holes 5 in a Cu-clad board, etching back the through-hole walls to expose the backside of a Cu foil around the through-holes 5, filling a conductive resin 7 in the through-holes 5 to planarize the surface, etching the Cu foil to pattern it, thus forming a core board 1 having conductive circuits 8 and lands 9, building up an insulation layer 10 on the core board 1, laser-boring holes reaching a specified depth into the conductive resin 7 of the through-holes 5, plating to form micro-vias 15 into the surface of the insulation layer 10 for electrically connecting the conductive circuits 13 with the conductive resin 7. |
