| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a polishing pad which highly precisely detects an optical endpoint in a state where polishing is performed, and is superior in a polishing characteristic (surface uniformity), and also to provide a manufacturing method of a semiconductor device using the polishing pad. <P>SOLUTION: The polishing pad 1 is used for chemical/mechanical polishing and it has a polishing region and a light transmission region 8. Light transmittance in the whole light transmission region 8 whose wavelength is 400 to 700nm is not less than 50%. <P>COPYRIGHT: (C)2004,JPO&NCIPI |
