发明名称 |
METHOD OF MANUFACTURING GATE STRUCTURE OF FET USING DESIRED PLASMA |
摘要 |
PURPOSE: A method of manufacturing a gate structure of an FET(Field Effect Transistor) is provided to remove polymeric residues from a substrate by using a desired plasma. CONSTITUTION: A substrate with a hafnium-containing layer and a polysilicon layer on the hafnium-containing layer is provided. A patterned mask is formed on the polysilicon layer(104). A plasma-etching process is performed on the polysilicon layer by using the patterned mask as an etching mask(106). At this time, polymeric residues are deposited on the substrate. The polymeric residues are removed from the substrate by using a plasma including one or more fluorocarbon-containing gas(110).
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申请公布号 |
KR20040090931(A) |
申请公布日期 |
2004.10.27 |
申请号 |
KR20040026447 |
申请日期 |
2004.04.17 |
申请人 |
APPLIED MATERIALS INC. |
发明人 |
KUMAR AJAY;NALLAN PADMAPANI C. |
分类号 |
H01L21/28;H01L21/02;H01L21/3065;H01L21/311;H01L21/3213;H01L21/8238;H01L27/092;H01L29/423;H01L29/49;H01L29/78;(IPC1-7):H01L21/335;H01L21/336 |
主分类号 |
H01L21/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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