SINGLE CHIP DUPLEXER FOR BONDING SUBSTRATE AND FABRICATING METHOD THEREOF, IN WHICH AN AIR GAP TYPE FBAR AND AN ISOLATION PART IS FORMED

摘要

PURPOSE: A single chip duplexer for bonding a substrate and a fabricating method thereof are provided to simplify a fabrication process by using an air gap type FBAR and an isolation part. CONSTITUTION: A first air gap and a second air gap are formed on an upper surface of a substrate(410). A second insulating layer(420) is deposited on the substrate of both sides of the first and the second gaps. A first air gap type FBAR is formed by fabricating a first laminated resonance part on the first air gap. A second air gap type FBAR is formed by fabricating the first laminated resonance part on the second air gap. An isolation part(500) is formed between the first air gap type FBAR and the second air gap type FBAR.