| 摘要 |
PURPOSE: A semiconductor device having plural IC chips mounted on a substrate is provided to test each of IC chips mounted on the substrate by connecting each of the IC chips to an external device of the substrate through an input line and an output line. CONSTITUTION: A semiconductor device includes a plurality of IC chips(2), an on-state resistance automatic compensation circuit(4), and a transistor element. The plural IC chips are arranged on a substrate and are connected to each other by using wires. Each of the plural IC chips is connected to an external device of the substrate by an input line and an output line. The transistor element is used as for identifying each operation of the plural IC chips. The transistor element is inserted into the wire for connecting the plural IC chips to each other. |
