COF tape carrier, semiconductor element, COF semiconductor device, and method for manufacturing of COF semiconductor device

摘要

A COF tape carrier includes a resist formed on the COF tape carrier. The resist has portions that define a resist opening within the resist so that a semiconductor element is mounted on the COF tape carrier in alignment with the resist opening. The COF tape carrier also includes ridges and valleys formed within the resist opening, the ridges and valleys extending in directions oblique to a perimeter of the resist opening. Inner leads are provided in the resist opening and have portions that extend in a direction oblique to the perimeter. The semiconductor element may include a surface, and ridges and valleys. The surface has perimeters that define the surface. The ridges and valleys are formed on said surface, each of the ridges and valleys extending in directions oblique to the perimeters.