| 摘要 |
According to some embodiments, an integrated high-quality printed circuit board is provided. For example, a first integrated circuit device may be mounted on both a first printed circuit board and a second printed circuit board (e.g., a polyimide film having better dielectric characteristics as compared to the first board). A second integrated circuit device may be located remote from the first integrated circuit device and may also be mounted on both the first and second boards.
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