发明名称 Inspection method and inspection apparatus for semiconductor circuit
摘要 A method and apparatus employing image processing of photographic data by a thermographic camera to determine the heat development of individual semiconductor devices. Therefore, defects of individual devices such as disconnection due to breaks and abnormal heat development due to electrostatic breakdowns can be determined reliably.
申请公布号 US6809532(B2) 申请公布日期 2004.10.26
申请号 US20020063869 申请日期 2002.05.21
申请人 MORIC KK 发明人 ARAKI CHIHIRO
分类号 G01R31/26;G01N25/72;G01R31/28;G01R31/309;G01R31/311;(IPC1-7):G01R31/302 主分类号 G01R31/26
代理机构 代理人
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