发明名称 |
Wire-bonding apparatus with improved XY-table orientation |
摘要 |
Wedge wire bonding apparatus are disclosed with an improved configuration in which the transducer axis lies on a line that bisects the XY axes, and the operator views the bonding process by looking directly along the axis of the transducer. The result is a shorter bonding cycle time as time is saved as the bonding head moves from a first to a second bonding position while at the same time the operator is placed in the best possible position for viewing the bonding operation, which facilitates in particular any necessary alignment and set-up steps.
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申请公布号 |
US6808102(B1) |
申请公布日期 |
2004.10.26 |
申请号 |
US20000649084 |
申请日期 |
2000.08.28 |
申请人 |
ASM ASSEMBLY AUTOMATION LTD. |
发明人 |
HO WING CHEUNG;HO SIU YAN;LAW HON SHING;CHUNG SIU WAI |
分类号 |
B23K20/00;(IPC1-7):B23K37/00;B23K31/02 |
主分类号 |
B23K20/00 |
代理机构 |
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代理人 |
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