| 摘要 |
For a two-layer printed wiring board including a polyimide substrate produced with varnish containing polyamic acid as the raw material for the polyimide and a copper alloy foil laminated with the polyimide substrate, there is provided, for the copper alloy foil, a copper alloy containing, in addition to copper and unavoidable impurities, either (1) 0.02 to 1.0 weight percent Ag and/or 0.01 to 0.5 weight percent In or (2) alloy composition (1) plus a total of 0.005 to 2.5 weight percent of at least one of the additional elements Al, Be, Co, Fe, Mg, Mn, Ni, P, Pb, Si, Ti and Zn, or (3) 0.001 to 0.5 weight percent Sn or (4) alloy composition (3) plus a total of 0.005 to 2.5 weight percent of at least one of the additional elements of alloy composition (2) and each of (1), (2), (3) and (4) preferably having a heat resistance of at least 300° C.
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