发明名称 |
Method for encapsulating leadframe-mounted integrated circuits |
摘要 |
A system is proposed for encapsulating in plastics material leadframe items comprising an IC wired to a leadframe. Dust of the plastics material is removed from the encapsulation system, and in particular from those items where dust principally accumulates, such as the surfaces of the molds. To reduce the level of dust which enters the molding region, the path along which the leadframe items are conveyed to the molding region is closed at times when the leadframe items are not being transported there. Additionally, the leadframe items are conveyed to the molding region under a cover including a vacuum source, so that the dust is continually sucked away from them.
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申请公布号 |
US6808661(B2) |
申请公布日期 |
2004.10.26 |
申请号 |
US20010013079 |
申请日期 |
2001.12.11 |
申请人 |
ASM TECH SINGAPORE PTE LTD |
发明人 |
ONG SEE YAP;WEE KOCK HIEN;HO SHU CHUEN;KUAH TENG HOCK;WU JIAN |
分类号 |
B29C45/14;B29C45/17;B29C45/18;B29C70/72;(IPC1-7):B29C31/08;B29C33/72;B29C45/02 |
主分类号 |
B29C45/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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