| 摘要 |
PURPOSE: A plating apparatus capable of rotating wafer is provided to overcome non-uniformity of current distribution between the upper portion and the lower portion of a wafer while maintaining the advantage of a vertical plating apparatus by making the wafer vertically soaked in a plating bath and rotating the wafer. CONSTITUTION: The wafer(10) is vertically soaked in the plating bath storing a plating solution. A wafer mounting head(11) vertically mounts the wafer on the side surface of the plating bath. A wafer rotating jig(20) is installed to rotate the wafer mounting head. A wafer driving unit is installed to drive the wafer rotating jig.
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