发明名称 Liquid circulation cooling system for electronic apparatus
摘要 In the structure of an electronic apparatus, in which cooling of an heat-generating element is conducted through circulation of a liquid, in particular, for providing a liquid-cooling structure of being high in reliability, while also considering safety and assembling property into the consideration, wherein a water-cooling jacket 8 is thermally connected with a heat-generating element 7, while thermally connecting a heat-radiation pipe 9 with a heat-radiation plate 10 provided on a rear surface of a display 2, wherein a coolant liquid is circulated between the water-cooling jacket 8 and the heat-radiation pipe 9, by means of a liquid driving device 11. The heat-radiation pipe 9 is connected onto a whole area of the heat-radiation plate, like crawling thereupon. A tank 14 is provided in an upper portion of the heat-radiation plate 10, and is connected with the heat-radiation pipe 9.
申请公布号 US6809927(B2) 申请公布日期 2004.10.26
申请号 US20030239141 申请日期 2003.05.09
申请人 HITACHI LTD 发明人 OHASHI SHIGEO;KONDO YOSHIHIRO;MINAMITANI RINTARO;NAGANAWA TAKASHI;YOSHITOMI YUUJI;NAKANISHI MASATO;KATOU HAJIME;NAKAGAWA TSUYOSHI
分类号 F25D17/02;F28F1/22;G06F1/20;H01L23/473;H05K7/20;(IPC1-7):H05K7/20 主分类号 F25D17/02
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