发明名称 |
Printed-circuit board and method of manufacture thereof |
摘要 |
A printed circuit board 1 providing superior adhesion between a substrate 2 and a conductor pattern 3 and preventing damage of the substrate 2. The width c of the bottom surface 310 of the conductor pattern 3 is greater than the width d of the top surface 320. Accordingly, the conductor pattern 3 has a trapezoidal cross-section. The two side surfaces 315 of a lower portion 31 of the conductor pattern 3 are coated by a solder resist. The two side surfaces 325 at the upper portion 32 of the conductor pattern 3 are exposed from the solder resist 4. A solder ball 6 engages the two side surfaces 325.
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申请公布号 |
US6809415(B2) |
申请公布日期 |
2004.10.26 |
申请号 |
US20000740424 |
申请日期 |
2000.12.19 |
申请人 |
IBIDEN CO., LTD. |
发明人 |
TSUKADA KIYOTAKA;KONDO MITSUHIRO;CHIHARA KENJI;ISHIDA NAOTO;SHOUDA ATSUSHI |
分类号 |
H05K1/02;H05K3/34;(IPC1-7):H01L23/48 |
主分类号 |
H05K1/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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