| 摘要 |
A dielectric multilayer substrate 220 is formed by laminating first through third dielectric layers 201 through 203. A plurality of conductor patches 204a through 204d are arranged on the upper surface of the first dielectric layer 201, and a microstrip line 205 for antenna feeding is arranged between the first and second dielectric layers. A ground layer 206 is arranged between the second and third dielectric layers 202 and 203, and microstrip lines 208a and 208b for a high-frequency circuit are arranged on the lower surface of the third dielectric layer 203. The microstrip line 205 for antenna feeding and the microstrip line 208a for the high-frequency circuit are electromagnetically coupled with each other via a slot hole 207 provided for the ground layer 206. With this arrangement, the efficiency and directivity of the antenna are improved. <IMAGE> |
