发明名称 |
Printed wiring substrate and method for fabricating the same |
摘要 |
A printed wiring substrate 1 includes a core substrate 2 having a front surface 3 and a back surface 4 and an chip capacitor 10 serving as an electronic component embedded via a resin 13 in a through-hole 5 extending through the core substrate between the front surface 3 and the back surface 4. The chip capacitor 10 has an electrode 12 projecting from the upper and lower ends thereof. The resin 13 contains silica filler (inorganic filler) f. The maximum particle size d of the silica filler f is not greater than half the height h of the electrode 12.
|
申请公布号 |
US6809268(B2) |
申请公布日期 |
2004.10.26 |
申请号 |
US20010916689 |
申请日期 |
2001.07.30 |
申请人 |
NGK SPARK PLUG CO., LTD. |
发明人 |
HAYASHI TERUHISA;HOTTA YASUTAKE;OGAWA KOUKI |
分类号 |
H01L23/498;H01L23/538;H05K1/18;(IPC1-7):H05K1/16 |
主分类号 |
H01L23/498 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|