发明名称 Method for fabricating 6F2 trench DRAM cell with double-gated vertical MOSFET and self-aligned STI
摘要 A memory cell containing double-gated vertical metal oxide semiconductor field effect transistors (MOSFETs) and isolation regions such as shallow trench isolation, STI, regions that are self-aligned to the wordlines and bitlines of the cell are provided. The inventive memory cell substantially eliminates the backgating problem and floating well effects that are typically present in prior art memory cells. A method of fabricating the inventive memory cell is also provided.
申请公布号 US6808981(B2) 申请公布日期 2004.10.26
申请号 US20030375654 申请日期 2003.02.27
申请人 IBM 发明人 MANDELMAN JACK A;DIVAKARUNI RAMACHANDRA;RADENS CARL J;BRONNER GARY B
分类号 H01L21/8234;H01L21/8242;(IPC1-7):H01L21/824 主分类号 H01L21/8234
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