RADIOLOGICAL IMAGE PICKUP APPARATUS

摘要

A portion corresponding to a surface lid section of a cabinet is formed using a nonconductive material. A structure is molded by using an insulating substance, an insulating plate member, and an insulating weir member so as to cover the whole of a radiation-sensitive semiconductor and a voltage application electrode on an active matrix substrate. The area from the outer frame of the cabinet to the margin of the voltage application electrode is shielded by a shield member so as to cover any other area than the portion just above the voltage application electrode from above the insulating plate member.