SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOF TO DECREASE NUMBER PROCESSES

摘要

PURPOSE: A semiconductor package is provided to decrease the number processes by eliminating the necessity of a conventional CMP(chemical mechanical polishing) process prior to a redistribution layer when an interconnection layer is formed on a device pattern surface of a wafer while a via electrode is formed. CONSTITUTION: A plurality of semiconductor packages(10) are formed on a wafer by a batch process. The resultant structure is diced into separated semiconductor packages. The semiconductor package is a stacked member in which at least two semiconductor devices are bonded to each other by using an insulation layer(15). Each semiconductor device includes a substrate and a device pattern formed on the surface of the substrate. The device pattern surface of a lower semiconductor device confronts a non-device pattern surface of the semiconductor device stacked on the lower semiconductor device.