SINGLE PACKAGE TYPE CRYSTAL OSCILLATOR, IN WHICH CRYSTAL PART AND IC CHIP ARE ARRANGED IN ONE CERAMIC PACKAGE

摘要

PURPOSE: A single package type crystal oscillator is provided to design efficiently components by miniaturizing a structure of a ceramic package. CONSTITUTION: An IC is loaded on an upper surface of a first ceramic layer(10). A lower end of a second ceramic layer(20) is connected to an upper edge of the first ceramic layer in order to form a loading region. A lower end of a third ceramic layer(30) is connected to an upper edge of the second ceramic layer in order to form a mounting region. A heterojunction member(50) is adhered on an upper end of the third ceramic layer. A lid part(40) is used for covering an upper part of the third ceramic layer. An isolation part(60) is formed horizontally to inner faces of the second and the third ceramic layers.