发明名称 ELECTROLESS COPPER PLATING METHOD OF POLYESTER POWDER FOR USE AS CONDUCTIVE FILLER
摘要 PURPOSE: A method for electroless plating polyester powder is provided to enable thickness control of coating film on the surface of the powder and enable preparation of conductive powder having uniformed and continuous thickness of the coating film by solving problems of partial non-plating and drop of plating adhesion property. CONSTITUTION: In an electroless plating method comprising a step of treating the surface of polyester powder of micron unit through a pretreatment step comprising degreasing, etching, neutralization, polarizing and activating processes, a step of completing plating by injecting copper sulfate aqueous solution(1), pH adjusting agent(3) and reducing agent(2) into the mixture after dipping the pretreated powder to be plated into complexing agent aqueous solution and agitating the pretreated powder in the complexing agent aqueous solution, and washing and drying the plated powder, the method for electroless plating polyester powder comprises the processes of preparing a suspension(8) by dipping the powder to be plated passing through the pretreatment step into distilled water and agitating the pretreated powder to be plated in the distilled water; causing activation of the reducing agent by injecting complexing agent(9) into the suspension and dropping pH adjusting agent and reducing agent into the suspension; performing plating by continuously supplying the copper sulfate aqueous solution(158 g/L), the pH adjusting agent and the reducing agent into the suspension in a certain equivalence ratio; and washing and drying the plated powder.
申请公布号 KR20040090163(A) 申请公布日期 2004.10.22
申请号 KR20030024101 申请日期 2003.04.16
申请人 HO JIN TECH CO., LTD. 发明人 CHO, JEOM JE;JUN, JI SEON;KIM, SUN TAEK;SEO, MIN GEUN
分类号 C23C18/16;(IPC1-7):C23C18/16 主分类号 C23C18/16
代理机构 代理人
主权项
地址