| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a surface mounting machine for surely sucking a semiconductor component to a suction collet in order to take out the semiconductor component housed in an emboss carrier tape. <P>SOLUTION: The surface mounting machine is constituted of the suction collet 6 disposed above the emboss carrier tape 5 and an air nozzle 7 disposed below it, and the air nozzle 7 is constituted of a nozzle main body 11, a rubber pad 12 and an elevating and lowering mechanism 13 at a lower part. The nozzle main body 11 is inserted to the elevating and lowering mechanism 13 and connected through a spring 14. In the case that the air nozzle 7 is elevated even after the rubber pad 12 is abutted on the emboss carrier tape 5 by the elevating and lowering mechanism 13, the nozzle main body 11 enters the elevating and lowering mechanism 13 and is contracted, and thus it is prevented from pushing up the emboss carrier tape 5. Compressed air for which charges by an ionizer 4 are discharged is jetted from the air nozzle 7 to the semiconductor component 8 to float the semiconductor component, suction is performed by the suction collet 6 and the semiconductor component 8 is taken out from the emboss carrier tape 5. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
