发明名称 PHOTOSENSITIVE RESIN COMPOSITION
摘要 <P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition which can realize both of sensitivity during exposure and alkali developing property and which gives a hardened product excellent in heat resistance and showing no brittleness. <P>SOLUTION: The photosensitive resin composition can form an alkali developable coating film and the composition contains a modified polymer (II) as the photosensitive resin component. The modified polymer (II) is obtained by; first preparing a polymer (I) by radical polymerization of a N-substituted maleimide component (A), an acid anhydride-containing radical polymerizable monomer component (B), and one or more kinds of radical polymerizable monomer component (C) copolymerizable with (A) and (B); and allowing a compound (D) having a photopolymerizable double bond and a hydroxyl group to react with a part of or all of the acid anhydride groups possessed by the polymer (I). <P>COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2004294999(A) 申请公布日期 2004.10.21
申请号 JP20030090428 申请日期 2003.03.28
申请人 NIPPON SHOKUBAI CO LTD 发明人 OTSUKI NOBUAKI;JOSA JUNICHI
分类号 G03F7/038 主分类号 G03F7/038
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