| 摘要 |
PROBLEM TO BE SOLVED: To reduce a warp of a wiring board and a semiconductor device, prevent cracking of the semiconductor device and improve reliability of electrical connection between connection terminals arranged on the wiring board and on the semiconductor device. SOLUTION: The curable composition includes an organic polymer having at least one curable hydrolyzable silyl group, a layered silicate, a colorant and a photo-stabilizer. The sealing material includes the curable composition. The adhesive includes the curable composition. COPYRIGHT: (C)2005,JPO&NCIPI
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