发明名称 PROCESS FOR SOLDERING ELECTRIC CONNECTOR ONTO CIRCUIT BOARD
摘要 In a process of soldering an electric connector on a circuit board, the connector has an insulator and a plurality of leads mounted inside the insulator. Each lead has a first end extending into a soldering terminal to a bonding surface of the insulator. A soft solder paste is dispensed over a bonding surface of the circuit board. The soldering process inserts the soldering terminal of each lead in the soft solder paste and applies heat to the soft solder paste to bond the soldering terminal and the circuit board together. The direct insertion of the soldering terminal of the lead into the soft paste on the circuit board minimizes the contact area between the lead and the circuit board and prevents the solder paste from being unduly spread, causing short circuit. Furthermore, the yield and soldering reliability are increased and the production cost is reduced.
申请公布号 US2004206802(A1) 申请公布日期 2004.10.21
申请号 US20030414198 申请日期 2003.04.16
申请人 JU TED 发明人 JU TED
分类号 B23K1/00;H01R43/02;H05K3/30;H05K3/34;(IPC1-7):B23K31/02 主分类号 B23K1/00
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