发明名称 RESIN COMPOSITION FOR MOLD USED IN FORMING MICROPATTERN, AND METHOD FOR FABRICATING ORGANIC MOLD THEREFROM
摘要 <p>A resin composition for a mold used in forming micropatterns comprises (A) 40 to 90 parts by weight of an active energy curable urethane-based oligomer having a reactive group; (B) 10 to 60 parts by weight of a monomer reactive with the urethane-based oligomer; (C) 0.01 to 200 parts by weight of a silicone or fluorine containing compound, based on 100 parts of the sum of the components (A) and (B); and (D) 0.1 to 10 parts by weight of a photoinitiator, based on 100 parts of the sum of the components (A), (B) and (C). The inventive resin composition can be easily cured by the action of an active energy ray, and the organic mold fabricated therefrom is easily lifted off from a master without irreversible adhesion or generation of defects and have excellent dimensional and chemical stabilities.</p>
申请公布号 WO2004090636(A1) 申请公布日期 2004.10.21
申请号 WO2004KR00860 申请日期 2004.04.14
申请人 MINUTA TECHNOLOGY CO. LTD.;KIM, TAE WAN;YOO, PIL JIN 发明人 KIM, TAE WAN;YOO, PIL JIN
分类号 B29C33/38;G03F7/00;G03F7/004;G03F7/027;G03F7/075;(IPC1-7):G03F7/027 主分类号 B29C33/38
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