| 摘要 |
<P>PROBLEM TO BE SOLVED: To improve surface roughness, especially haze, of a polished object such as a semiconductor wafer with polishing cloth for finish polishing. <P>SOLUTION: The surface roughness of the suede-like polishing cloth used for finish polishing such as the semiconductor wafer is set at 5 μm or less in arithmetic mean roughness (Ra). By performing finish polishing of the semiconductor wafer such as a silicon wafer with the suede-like polishing cloth, the haze of the semiconductor wafer is largely reduced. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
