发明名称 MICRO HOLE GRINDING DEVICE
摘要 PROBLEM TO BE SOLVED: To enable highly precise automated working of a micro hole of a work. SOLUTION: The work W is held by a work chuck 11 so that the micro hole H of the work W directs in a vertical direction. While the tip of a straight wire 10 inserted into the micro hole H is grappled by wire clamps 51 and 51, the wire 10 is rewound by rotating a wire real 31 with a motor 34 for winding the wire, and is held in a suitable tension added state. The work chuck 11 for holding the work W made rotatable by an air blow 17, a driving belt 14 is mounted to the work chuck 11 to make it liftable vertically by the motor, and the inner peripheral surface of the micro hole H in the work W is slidably contacted with the outer peripheral surface of the wire 10 to be ground while the work W is being rotated and lifted. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2004291177(A) 申请公布日期 2004.10.21
申请号 JP20030088693 申请日期 2003.03.27
申请人 SEIKO INSTRUMENTS INC 发明人 TERAYA JIYUNJI;MAKISHIMA YUTAKA;IWADATE HIDEO;MORITO HIDEKAZU;SHINTANI HIROYUKI
分类号 B24B5/40;B24B5/48;B24B37/00;(IPC1-7):B24B37/00 主分类号 B24B5/40
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