| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for mounting an electronic component by which a heat generating from an electronic component can be efficiently radiated and temperature rise of the electronic component can be suppressed. SOLUTION: A heat sink 1 for heat radiation is brought into contact with the rear surface of a circuit board 2 wherein a pattern circuit part 5 including a ground circuit 4 is provided on its surface, with an insulation layer 3 in between. The heat sink 1 is partly exposed at a specified position on the surface of the circuit board 2, and the ground circuit 4 is connected with the part of the exposed heat sink 1. COPYRIGHT: (C)2005,JPO&NCIPI
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