| 摘要 |
PROBLEM TO BE SOLVED: To provide a package for housing an electronic part by which the electrode of the electronic part is surely connected to a wiring conductor formed on the upper surface of the inner peripheral part of a frame via bonding wire. SOLUTION: As for the package 6 for housing the electronic part, a first frame 2 and a second frame 3 having an opening larger than the first frame 2 are fitted to the upper surface of a substrate 1, and at least a part of the inner peripheral part of the first frame 2 is exposed for forming the wiring conductor 4 with which the electrode of the electronic part is connected on the upper surface of this. In an area outside of the array of the wiring conductor 4 in the upper surface of the inner peripheral part where the first frame 2 is exposed, rectangular conductor patterns 7 are formed respectively in a direction along the inner periphery of the first frame 2 at the site of the inner peripheral side of the first frame 2, and in a direction along the inner periphery of the second frame 2 at the site of the inner peripheral side of the second frame 3. Various kinds of misregistration can easily be identified with the rectangular conductor patterns 7, thereby surely connecting the bonding wire. COPYRIGHT: (C)2005,JPO&NCIPI
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