| 摘要 |
PROBLEM TO BE SOLVED: To efficiently remove a CF film adhering to the treating vessel of a plasma treatment device which forms CF films on, for example, wafers. SOLUTION: At the time of cleaning down a CF film adhering to the inside of the treating vessel after the formation of CF films is performed in the vessel, the CF film adhering to the inside of the treating vessel is decomposed into F and C with oxygen plasma by generating the plasma in the vessel and most of the F and C which are the decomposition products are removed. Then organic matters containing C and O adhering to the inside of the treating vessel are removed by dissolving the organic matters with hydrogen plasma by generating the plasma in the vessel. When this method is used, the inside of the treating vessel 1 can be cleaned certainly while a high cleaning rate is secured, because the CF film and organic matters containing C and O are respectively decomposed efficiently with the oxygen plasma and hydrogen plasma. COPYRIGHT: (C)2005,JPO&NCIPI
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