| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition having excellent fluidity, adhesiveness to a substrate, flame retardance and solder crack resistance without using a bromine-containing organic compound and an antimony compound. SOLUTION: The epoxy resin composition for sealing a semiconductor is characterized as follows. The composition consists essentially of a phenol aralkyl type epoxy resin having a biphenyl skeleton, a phenol aralkyl resin having the biphenyl skeleton, a curing accelerator, an inorganic filler, a specific silane coupling agent having a secondary amine and a specified silane coupling agent having an epoxy group. COPYRIGHT: (C)2005,JPO&NCIPI
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