发明名称 HEAT SINK HOLD-DOWN WITH FAN-MODULE ATTACH LOCATION
摘要 A system for heat sink hold-down is provided. The system comprises a heat source; and a heat sink hold-down assembly. The assembly comprises a bolster plate to rigidly support the heat source and a heat sink. The heat sink comprises a heat sink base operable to transfer heat and to press the heat source against the bolster plate, and a longitudinal post having a first end attached substantially orthogonally near the center of said heat sink base. The post is operable to transfer a compressive force substantially symmetrically to the heat sink base. The assembly further comprises a lever spring contacting the second end of the post. The lever spring is operable to apply a compressive force to the post in response to a bending moment. The assembly further comprises a cap rigidly coupled to the bolster plate and operable to apply a bending moment to the lever spring.
申请公布号 US2004207986(A1) 申请公布日期 2004.10.21
申请号 US20030419386 申请日期 2003.04.21
申请人 RUBENSTEIN BRANDON A. 发明人 RUBENSTEIN BRANDON A.
分类号 H01L23/433;H01L23/467;(IPC1-7):H05K7/20 主分类号 H01L23/433
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